Flow carrier for post-reflow attachment
Reduce stress on components! Protects reflowed PCBs during soldering with excellent thermal insulation properties.
This product is a carrier used for soldering after-market components (such as capacitors and heat sinks) using a dip layer after reflow. During soldering, it protects the reflowed substrate with excellent thermal insulation properties, reducing stress on the components. With conventional materials (such as glass epoxy), issues (such as warping) occur after 400 to 600 dips, but our material can be used semi-permanently. 【Features】 ■ Can be used semi-permanently ■ Can be repaired and reused even if damaged ■ Has conductivity ■ Reduces stress on components *For more details, please refer to the PDF document or feel free to contact us.
- Company：大伸産業
- Price：Other
